About TechSprint 2023
The G20 TechSprint is a joint initiative between the G20 Presidency and the Bank for International Settlements Innovation Hub (BISIH) to seek out best-in-class novel technological solutions aimed at addressing high priority areas of interest amongst the global community.
Under India's G20 Presidency, the Reserve Bank of India and the BISIH are soliciting innovative technological solutions to transform global cross-border payments landscape in the fourth edition of the G20 TechSprint. We invite the international community of innovators, entrepreneurs, start-ups, changemakers, creators, developers, data scientists, designers, digital marketing and communication experts who are passionate about creating extraordinary impact to come up with innovative technological solutions to key challenges in the cross-border payments arena.
If you have what it takes and share the desire to showcase your talent to enable cross border payments faster, cheaper, secure and more transparent, well, this is the place. Join forces with other talented people and take part in this contest.
